As a Graduate Physical Design Engineer, you will participate in the development of advanced semiconductor products and be involved in the complete physical implementation flow.
Your responsibilities include:
- Support SoC and subsystem physical design implementation from netlist to GDSII.
- Participate in floorplanning, power planning, placement, clock tree synthesis (CTS), routing, and chip finishing activities.
- Perform timing, power, signal integrity, and physical verification analysis.
- Debug design implementation issues and drive convergence toward project PPAC (Performance, Power, Area, Cost) targets.
- Work with cross-functional teams including RTL Design, DFT, Verification, IP, Package, and Technology teams.
- Develop and improve EDA automation scripts using Python, Tcl, or other scripting languages.
- Explore AI-assisted design methodologies to improve engineering productivity and design quality.
- Support silicon bring-up, design reviews, and tapeout activities.
- Contribute to continuous improvement of backend methodologies, flows, and best practices.
Qualifications：
- Master's degree (graduating in 2027) in:
- Microelectronics
- Integrated Circuit Design
- Electronic Engineering
- Computer Engineering
- Automation
- Related disciplines
- Basic knowledge of VLSI design flow and semiconductor fundamentals.
- Familiarity with Linux/Unix environments.
- Programming experience in Python, Tcl, Perl, Shell, or C/C++.
- Strong analytical and problem-solving skills.
- Good communication and teamwork skills.
- Fluent written and spoken English.
Preferred
- Coursework or project experience in:
- ASIC/SoC Design
- Physical Design
- Timing Analysis
- DFT
- Digital IC Design
- Hands-on experience with EDA tools such as:
- Synopsys Fusion Compiler
- ICC2
- PrimeTime
- Cadence Innovus
- Tempus
- Calibre
- Experience with machine learning or AI applications in semiconductor design.
- Publications, competitions, or research projects related to EDA or IC design are a plus.
More information about NXP in Greater China...
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