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Toulouse, France
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Quandela is a global leader in photonic quantum computing, developing hardware and software technologies to build scalable and energy-efficient quantum systems.
With more than 140 people, we develop our own stack, from semiconductor quantum emitters and photonic integrated circuits to quantum control systems, software and algorithms.
Our ambition is to build large-scale fault-tolerant quantum computers. Reaching this scale requires increasingly reliable, manufacturable and integrated photonic hardware, making our Integrated Photonics team a key part of this journey.
You will join our Integrated Photonics team, working across Massy and Palaiseau at the interface between PIC design, characterization, packaging and system integration.
We are looking for a hands-on Photonic Packaging Engineer to take ownership of our packaging activities, improve existing processes and help make our PIC integration more reliable and reproducible.
Your first priority will be to contribute to ongoing packaging activities, develop and improve assembly processes, and troubleshoot integration challenges alongside our PIC design and characterization teams.
As you grow into the role, you will also have the opportunity to develop new packaging approaches, coordinate technical projects and contribute to building more structured and scalable packaging capabilities.
Today, packaging activities involve several members of our team. Having a dedicated engineer will help us accelerate ongoing developments, improve the reproducibility of our processes and strengthen the connection between PIC design, characterization and system integration.
As our PIC platforms evolve, your work will also contribute to developing new integration approaches and preparing our packaging processes for future scale-up.
Requirements
Develop and improve photonic packaging processes:
• Take ownership of ongoing packaging activities and improve existing processes.
• Develop optical coupling, precision alignment and fiber-array attachment methods.
• Work on component assembly, bonding and electrical interconnections.
• Address mechanical and thermal integration challenges.
• Test new approaches, troubleshoot issues and improve process reproducibility.
Qualify and improve packaged devices:
• Build and test prototypes to validate packaging approaches.
• Define performance metrics, tolerances and acceptance criteria.
• Characterize packaged PICs alongside the PIC Characterization team.
• Troubleshoot optical, electrical and mechanical integration issues.
• Establish repeatable procedures and technical documentation.
Connect packaging with PIC design:
• Work closely with PIC Designers to anticipate packaging constraints.
• Translate assembly challenges into practical design-for-packaging guidelines.
• Collaborate with characterization and system-integration teams to improve packaged device performance.
Build the packaging capability:
• Collaborate with external packaging partners and equipment suppliers.
• Improve existing equipment, assembly methods and internal capabilities.
• Explore new packaging technologies and integration approaches.
• Support automation to improve accuracy, reproducibility and throughput.
• Progressively lead technical projects and contribute to future scale-up.
0–3 months → Get familiar with our PIC platforms, existing packaging processes and integration challenges. Contribute to ongoing activities and start taking ownership of selected technical tasks.
3–6 months → Take increasing responsibility for packaging processes, develop and test improvements, and contribute to making our assembly methods more reliable and reproducible.
6–12 months → Lead packaging development activities within your area of expertise, strengthen our qualification and documentation practices, and contribute to new packaging approaches and technical projects.
Longer term → Depending on your experience and interests, grow into a broader technical role, leading packaging projects, strengthening external partnerships and helping shape our future packaging capabilities.
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Must-have:
• Master's or PhD in Photonics, Physics, Engineering, Microelectronics or related fields.
• Hands-on experience in photonic, optoelectronic or semiconductor packaging.
• Practical experience in optical alignment, component assembly or related processes.
• Good understanding of packaging tolerances, process development and qualification.
• Ability to troubleshoot integration issues and develop reliable packaging solutions.
• Professional English.
Important, but you can grow here
• Fiber-array / FAU attachment and fiber-to-chip coupling
• Wire bonding, flip-chip integration or other electrical interconnection techniques.
• Design for packaging, assembly and manufacturability
• Mechanical and thermal integration
• Experience working with external packaging suppliers or technology partners
• Automation of packaging or precision-assembly processes
Bonus
• Packaging of integrated photonic devices
• Experience with active photonic or optoelectronic components.
• Cryogenic packaging
• High-density electrical interconnection
• Semiconductor production, process-engineering or NPI experience
• Experience developping packaging equipment
• Previous experience coordinating technical projects or leading packaging development activities.
> You do not need previous experience in quantum computing.
> What matters most is your ability to work hands-on with packaging processes, understand integration challenges and help us develop reliable and reproducible solutions.
Benefits
Join a growing quantum hardware company and contribute directly to the development of next-generation photonic quantum processors.
• Take ownership of key PIC packaging activities and processes.
• Develop reliable and reproducible packaging solutions.
• Grow your expertise and contribute to future packaging developments.
• Collaborate with PIC design, characterization and integration teams.
• Work across photonics, semiconductor packaging and quantum hardware.
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• Competitive compensation aligned with your experience and level of responsibility
• Company savings plan
• 100% health coverage (Alan)
• Transport reimbursement or mobility bonus
• Swile meal vouchers
• Access to Gymlib
If your background is slightly different from what is described above but you bring strong hands-on experience in photonic, optoelectronic or semiconductor packaging, we still encourage you to apply.