•Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
•Responsible for quality, yield, cost and process improvement activities.
•Responsible for process documentation, process spec, standard work instruction, OCAP, QIT etc.
•Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.
•Take ownership to work closely with upper management to align scope and direction of key projects.
Requirements:
•3-6 years of work experience with semiconductor assembly background for automotive customers.
•Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.
•Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.
•Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.
•Good SPC, Process Control and other relevant statistical & problem-solving skills
•Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.
More information about NXP in Malaysia...
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