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As a Physical Design Engineering Undergraduate Intern, you will play a key role in supporting the development of cutting-edge semiconductor solutions. You will contribute to the creation, optimization, and verification of physical design and layout for high-performance systems-on-chip (SoCs). Your work will help ensure efficient designs that meet power, performance, and area targets, making a tangible impact on Intel's product roadmap and technological advancements. Business group You will be part of Intel's Data Center Group (DCG), which focuses on designing and delivering innovative solutions to meet the growing demands of data-centric computing. DCG drives improvements in cloud computing, AI, and edge innovations, supporting Intel's mission to enable a smarter, connected world.
The primary responsibilities for this role will include, but are not limited to:
Minimum Qualifications:
Minimum qualifications are required to be initially considered for this position.
Preferred Qualifications:
Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
We invite you to bring your curiosity, creativity, and drive to Intel as we work together on technologies that shape the future of computing.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.