Job Details:Job Description:
Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of technology. With a legacy of over 50 years of engineering excellence, Intel is at the forefront of advanced chip design, manufacturing, and packaging technologies. Our Arizona facilities are home to some of the most cutting-edge semiconductor fabrication and packaging operations in the world, where we push the boundaries of what's possible every single day. At Intel, we believe in the power of our people — diverse, curious, and driven — to solve the world's most complex engineering challenges.
Intel's Substrates Packaging Technology Development (SPTD) organization is seeking an experienced and dynamic Shift Engineering Manager to lead the Module Engineering On-Shift (MEOS) team on Shift 6 or Shift 4. This is a critical leadership role within our 24x7 Compressed Work Week (CWW) engineering operation, based at our Arizona manufacturing facilities (CH1/CH8 factories).
This position is based in Arizona. Compensation for this role will be determined in accordance with the applicable salary range for the Arizona work location, as well as factors such as skills, qualifications, and experience.
Shift Information
This requisition is being used to identify candidates for two separate openings within the team:
- 1 opening on Shift 4
- Shift Hours: 6:00 PM – 6:00 AM
- Schedule: Alternating 3- and 4-day work weeks (Sunday–Tuesday and alternating Saturdays)
- 1 opening on Shift 6
- Shift Hours: 6:00 PM – 6:00 AM
- Schedule: Alternating 3- and 4-day work weeks (Wednesday–Friday and alternating Saturdays)
Candidates may be considered for either opportunity based on business needs, qualifications, and shift availability. During the hiring process, the recruiting team will discuss the specific shift assignment and schedule details with selected candidates.
Key Responsibilities:
- Lead a high-performing team of approximately 12 on-shift engineers focused on advanced substrates technology development across the CH1/CH8 factories in Arizona.
- Serve as the primary on-shift engineering escalation point, responding rapidly to MEOS escalations and leading/responding to Emergency Operations Center (EOC) events as required, acquiring Emergency Response Team (ERT)/ Incident Commander (IC) certification within the first year of the job.
- Drive structured problem-solving on shift, leveraging MBPS methodology to lead SWATs and Task Forces, resolving complex tool and process issues with speed and precision.
- Champion factory performance improvements across safety, quality, output velocity, yield, capacity, and capability — both within and across shifts.
- Develop and execute a capability improvement roadmap for the MEOS team, including strategic staffing plans and targeted employee skill development initiatives.
- Foster strong cross-functional collaboration by building robust networks with Factory Operations, Equipment Engineering, Module Engineering, and Facilities Engineering teams.
- Optimize on-shift resource deployment to ensure MEOS team efforts are aligned with and maximizing value to organizational objectives.
- Build an engineering problem-solving culture within the team, developing expertise in tool health management and integrated process health to drive factory velocity across multiple First-of-Kind (FOK) tool sets.
- Invest in your team's growth through robust career development plans, engagement initiatives, and retention strategies that attract and keep top engineering talent.
As a Successful Candidate, You Will Bring:
- Exceptional leadership presence — you inspire confidence and motivate your team even in high-pressure, fast-moving situations.
- Strong communicator — you communicate clearly and effectively across all levels, from engineers on the floor to senior leadership.
- Collaborative mindset — you naturally build bridges between teams and thrive in cross-functional environments.
- Resilience and adaptability — you remain composed and decisive when faced with ambiguity, complexity, or unexpected challenges on shift.
- Coaching and mentoring instinct — you genuinely invest in the growth and development of the people around you.
- Analytical and critical thinking — you approach problems with curiosity and structure, driving root cause resolution rather than quick fixes.
- Accountability and ownership — you take pride in outcomes and hold yourself and your team to the highest standards.
- Growth mindset — you are continuously learning and encourage your team to do the same.
If you are a passionate engineering leader ready to drive innovation in advanced semiconductor packaging at one of the world's most respected technology companies, we want to hear from you.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.
Minimum Qualifications:
- Bachelor’s degree in engineering or a related field with 4+ years of relevant experience, OR
- Master’s degree in engineering or a related field with 3+ years of relevant experience, OR
- PhD in engineering or a related field.
- 1+ years of experience as a Team Lead or First Line Manager (FLM) in a technical or engineering environment.
- Relevant experience is Domain-specific knowledge in semiconductor fabrication or package/assembly/test.
Preferred Qualifications:
- 2+ years of experience working in a 24x7 factory environment, with demonstrated skills in problem-solving and navigating ambiguous situations involving tools, processes, and tool-facility interactions.
- 2+ years of hands-on experience in semiconductor fabrication or package/assembly/test.
Job Type:
Experienced Hire
Shift:
Shift 6 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.