Please Note:
1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
Job Description:
Broadcom is seeking an experienced IC Package Design Project Manager to lead a team of engineers designing complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. In this role, you will support the engineering team with project management, and opportunities to contribute to technical methodologies.
RESPONSIBILITIES:
Create and track project plans for 20+ concurrent designs (scope, schedules, resources)
Improve scheduling methodologies and task tracking and coordination
Organize team and customer activities to keep projects on track
Communicate plans, status, next steps and risks
Create technical methodologies for package design
Steering package technology and design rules, with input from team members
Customer, vendor, and cross-functional collaboration
EDUCATION/EXPERIENCE & REQUIREMENTS:
Preferred candidates have previous experience managing package design projects
Bachelors and 12+ years of related experience; or Masters degree and 10+ years of related experience
Knowledge of package-level signal integrity and power integrity, to apply to package designs
Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
Self-management and organization skills
Technical understanding related to package design:
Package-Design lifecycle
How the substrate and package fit into the overall ASIC design and manufacturing flows
Design Data, including how it is created and used: .mcm, package spreadsheet, drawings (POD, Lid, Substrate)
DFx trade offs (Design for “x”, where is x is manufacturability, reliability, assurance of supply, SI/PI, etc)
Layout
SI/PI extractions and Simulations
Automation code development
Mechanical & Thermal modeling
Project Management
New Business Quotes
OTHER REQUIREMENTS
This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position
Occasional travel may be required
Compensation and Benefits
The annual base salary range for this position is USD To USD
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.